Combination of Digital Image Correlation and
Thermographic Measurements

The combination of measuring results from the digital image correlation (ARAMIS, DIC) and temperature measuring
data from infrared cameras enables the simultaneous analysis of the thermal and mechanical behavior of test
specimens in the materials and components testing field.

The ARAMIS system measures by using a contact‐free and material‐independent method based on the principle of
digital image correlation.
The images of the test specimens under load that were recorded with high‐resolution cameras or high‐speed cameras
are evaluated. The system determines the gray value distribution for thousands of subsections in each camera image
and gives the subpixel‐accurate positions of the corresponding measuring points in all images, from which then the 3D
coordinates are calculated by triangulation.
The evaluation of this surface information for all load levels during the time in the 3D space delivers the exact X, Y and
Z displacements, velocities and accelerations. Furthermore, ARAMIS determines from the 3D coordinates the surface
strains, such as, major and minor strain.

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