E-LIT − Electronic / Semiconductor Testing Solution

E-LIT – Lock-In Thermography for Electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.

The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK temperature differences are reliably detected by the lock-in thermography system.

Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.

The powerful lock-in thermography software uses the latest algorithms and routines from most recent scientific publications.

E-LIT is extremely powerful also in resolving smallest geometrical structures as it can be equipped with strong microscopic lenses and additional SIL lenses. Identifying smallest structures with InfraTec´s E-LIT does not mean that the resulting field of view will also be smallest – implementing thermal cameras with detector sizes of up to (1,920 x 1,536) pixels provide large scale microscopic imaging. For even larger imaging stitching options are available

Bene­fits of the Modular Test Bench

  • Online lock-in measurement with the highest sensitivity
  • Complete and detailed microscopy analysis
  • Geometrical resolution up to 1.3 μm per pixel with microscope lenses
  • Thermal resolution in the microkelvin range
  • Multi-layer analysis
  • Automatic scanning of larger samples due to precision mechanics

Ther­mo­graphic Soft­ware IRBIS® 3 active

  • Operational software with comprehensive analysis options in laboratory conditions
  • Software add-on for automatic error classification based on parameter settings
  • Intuitive user interface for easy operation
  • Real-time display of the object being measured in various states
  • Multifaceted memory options for image data and measurement results
  • Alternative 0°, 90° or customised set phase angle image for representation of complex intensity information
  • Merging live and amplitude image
  • Optional: IV measurement, under sampling, drift compensation, DC-mode, power loss measurement, user and protocol administration, interface preparation: e.g. Profibus, Ethernet
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